Method and apparatus for forming the separating lines of a photovoltaic module with series-connected cells

ABSTRACT

For forming the separating lines, ( 5, 6, 7 ) which are produced in the functional layers ( 2, 3, 4 ) deposited on a transparent substrate ( 1 ) during manufacture of a photovoltaic module with series-connected cells (C 1 , C 2 , . . . ), there are used laser scanners ( 8 ) whose laser beam ( 14 ) produces in the field ( 17 ) scanned thereby a plurality of adjacent separating line sections ( 18 ) in the functional layer ( 2, 3, 4 ). The laser scanners ( 8 ) are then moved relative to the coated substrate ( 1 ) in the direction (Y) of the separating lines ( 5, 6, 7 ) by a distance corresponding at the most to the length (L) of the scanned field ( 17 ) to thereby form continuous separating lines ( 5, 6, 7 ) through mutually flush separating line sections ( 18 ).

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of U.S. patent application Ser. No.12/381,529, filed Mar. 12, 2009, which asserts priority from GermanPatent Application No. 10 2008 014 263.8, filed Mar. 13, 2008. Applicanthereby incorporates the disclosures of these applications by referencein their entireties.

BACKGROUND OF THE INVENTION

This invention relates to a method for forming the separating lines thatare formed in the functional layers on the transparent substrate duringmanufacture of a photovoltaic module with series-connected cells,according to the preamble of claim 1. It also relates to an apparatusfor carrying out the method.

During manufacture of a photovoltaic module there are deposited over theentire surface on the electrically insulating transparent substrate,normally a glass plate, the transparent front electrode layer, thesemiconductor layer and the back electrode layer which constitute thefunctional layers of the module.

The individual monolithic layers are patterned by separating lines e.g.with a laser so as to form series-connected strip-shaped cells. Thegenerated current is collected by contacting the two outermost cells. Itis thus possible to realize thin-film modules with different voltages,e.g. for 12 V consumers.

For patterning, the coated substrate is typically disposed on a tablemovable in the X and Y directions. It is instead possible to use amovable gantry with the laser or a table movable in the Y direction anda stationary gantry with a laser movable in the X direction (a so-called“split-axis system”), which will hereinafter be representative of theother systems in describing the prior art.

In the split-axis system, at least one laser beam is focused into thethin functional layers with at least one focusing optic movable along agantry in the X direction, i.e. perpendicular to the separating lines tobe formed. Motion of the coated substrate under the focusing optic inthe Y direction, i.e. in the direction of the separating line to beformed, then causes the separating line to be formed in the functionallayer by the focused laser beam.

The separating lines reduce the photovoltaically active area by theirsurface area and thus do not contribute to converting sunlight toelectrical energy. It is therefore necessary to make the separatinglines narrow, whereby they typically have a width of 50 μm. Also, thedistances between the separating lines, which must be counted as lostareas, should he as small as possible to minimize the total area lostthrough the integrated series connection. This results in high demandson the precision or tolerances of the patterning system. For example, iftwo adjacent separating lines are 100 μm apart and said lines aretypically 50 μm wide, they may touch each other at the most but must notoverlap, a tolerance or precision of +/−25 μm for the patterning systemis necessary. If a module has for example 160 series-connected cells,160 separating lines are necessary per functional layer. For a modulewith a size of for example approx. 1.4 m² (e.g. 1100 mm×1300 mm), thereare thus 40 motions required in the ideal case for example with fourfocusing optics on the gantry.

At an annual capacity of for example 90,000 coated substrates perpatterning system, this then results in 3.6 million motions perpatterning system, which are carried out at an extremely fast motionspeed, typically 1200 mm/s. In such an oscillating motion system, theacceleration times and the feed motions of the focusing optics to thenext separating line must also be taken into account.

The constructions for said patterning systems are therefore elaborate,heavy and cost-intensive. At for example 160 separating lines on a 1300mm long substrate, four focusing optics, a motion speed of 1200 mm/s, anacceleration of 2 g and a feed time in the X direction of 0.3 s, theresulting processing time for the module is approx. 60 seconds. Inaddition there are typically approx. another 30 seconds per laserprocessing step for loading and unloading, fixing, and positiondetection of the coated substrate for example by image processing.

To increase throughput with the same precision or tolerance of thepatterning system, it is possible not only to increase the number offocusing optics but also to increase the motion speed of the patterningsystem, but this makes the constructions substantially more complex,larger, heavier and costlier.

The industrial manufacture of photovoltaic module requires a pluralityof costly machines. The machine for semiconductor coating usuallyinvolves the highest investment costs. In addition, the above-mentionedlaser machines are important cost factors.

The capacity of the semiconductor coating machine and the capacity ofthe laser machines are usually different. Being the costliest machine,the semiconductor coating machine is generally utilized at a rate of100%.

If the semiconductor coating machine performs for example a coating of210,000 modules per annum at the most, and each patterning machine perfunctional layer (front electrode layer, semiconductor layer, backelectrode layer) is designed for 90,000 modules per annum, this has theconsequence that altogether nine costly laser machines must be procured.The number of laser machines therefore leads to a considerable costproblem in the industrial manufacture of photovoltaic modules.

It is therefore the object of the invention to provide a method andapparatus permitting the costs to be considerably reduced for formingthe separating lines in the functional layers in the industrialmanufacture of photovoltaic modules.

This is achieved according to the invention by the method characterizedin claim 1. The subclaims 2 to 5 present advantageous embodiments of theinventive method. Claim 6 relates to a preferred apparatus for carryingout the inventive method, which is developed advantageously by themeasures of claims 7 to 17.

According to the invention, the laser used is at least one laser scannerwhose laser beam produces in the field scanned thereby a plurality ofadjacent separating line sections in the functional layer, the laserscanner being moved relative to the coated substrate, after scanning thefield, in order to form continuous separating lines extending over thetotal length of the module through mutually flush separating linesections.

The relative motion of laser scanner and coated substrate is preferablyeffected in the direction of the separating lines by a distancecorresponding at the most to the length of the scanned field. Thedirection of relative motion can be the Y or X direction.

The transparent front electrode layer can consist of an electricallyconductive metal oxide, for example tin oxide (SnO2), zinc oxide (ZnO)or another material. The semiconductor layer can consist of silicon, forexample amorphous, nano-, micro- or polycrystalline silicon, but also ofother semiconductors, for example cadmium tellurium or copper indiumgallium selenide (CIGS). The back electrode layer is preferably a metallayer, consisting for example of aluminum, copper, silver or the like.Alternatively, a non-transparent substrate can also be used.

The substrate can be formed by a glass plate or another transparent,electrically insulating material.

The at least one laser scanner is disposed on a holder which is movableby a device relative to a receiving means for the coated substrate.

The laser beam of the laser scanner scans a field or a focusing surfacewith a size of preferably at least 100 cm² on the functional layer thatis to be provided with the separating line. For this purpose, the laserscanner is provided with at least one mirror which guides the laser beamonto the functional layer.

To produce a line, i.e. a section of the separating line in the field,the mirror is preferably rotated with a galvanometer drive. Afterproducing the individual line or separating line section in the field,the laser beam must be aligned with the next line in order to producethe next parallel separating line section in said field.

This means that the mirror must then be deflected first in the Xdirection, i.e. in a direction extending transversely or perpendicularto the separating line direction, by a distance corresponding to thedistance between two adjacent separating lines, before the nextseparating line section is produced in said field.

Preferably, the laser scanner has for this purpose in each case twomirrors movable orthogonally to each other which reflect the laser beamand are preferably driven by a galvanometer drive.

In this way it is possible to produce with the scanner software amultiplicity of parallel adjacent separating line sections in the fieldin question.

This means that the at least one laser scanner can be moved in the Xdirection relative to the coated substrate by a distance correspondingat the most to the width of the scanned field until the coated substrateis provided with the adjacent separating line sections across its totalwidth. Subsequently, laser scanner and substrate are moved relative toeach other by at the most one field length in order to form the next rowof separating line sections extending in the X direction which areconnected to the previously formed separating sections, etc.

It is possible to shift the at least one laser scanner on the holder,i.e. for example on a gantry extending over the coated substrate, in theX direction by a distance corresponding to the width of the field inorder to form the separating line sections in the field adjoining in theX direction.

However, it is also possible to provide a plurality of laser scanners onsuch a gantry side by side, resulting in a row of laser scannersextending transversely across the substrate, i.e. one field follows theother, all fields of a row being lasered by the particular laserscanners simultaneously.

In this way it is possible to produce separating line sections extendingin the Y direction in the functional layer across the total width of thesubstrate with a motion of the substrate relative to the row of laserscanners. In the next step, the substrate and the row of laser scannersare moved relative to each other by one field length at the most tothereby extend the separating line sections step by step until theindividual mutually flush separating line sections form the continuousseparating lines in said functional layer.

It is essential that when a plurality of laser scanners are used, thewidth of the field scanned by one laser scanner is dimensioned in the Xdirection such that it is at the most one separating line spacing awayfrom the field scanned by the adjacent laser scanner. However, anoverlap of the fields is preferably effected.

In particular, an overlap of the field is necessary when the separatinglines extend in the functional layers not in the Y direction of thecoated substrate, but in the X direction thereof, i.e. not in thelongitudinal direction of a rectangular substrate, but transversely. Forthis purpose, the laser scanners on the gantry form continuousseparating lines extending across the total width of the coatedsubstrate or in the X direction. There is then effected a relativemotion of the laser scanners and of the substrate in the Y direction bya distance corresponding at the most to the width of the fields of thelaser scanners, optionally plus one separating line spacing, whereuponthe laser scanners again form continuous separating lines extendingacross the total width of the coated substrate or in the X direction.This process is repeated until the coated substrate is provided with theseparating lines over its total length, i.e. also in the Y direction.

Such a laser scanner can produce the separating line sections at a highspeed of preferably at least 1 m/s, in particular at least 5 m/s. Thefields scanned by the laser beam for producing the separating linesections preferably each have an area of at least 100×100 mm².

When a plurality of laser scanners are provided, they can be so disposedthat the areas scanned thereby adjoin each other in the X direction andare mutually flush. However, it is also possible to dispose the adjacentlaser scanners on the holder so as to be offset in the direction of theseparating lines, i.e. the Y direction, such that a laser scanner offsetin one direction is aligned in staggered relationship with two laserscanners offset in the other direction.

The inventive apparatus can be configured both as a gantry system and asa split-axis system.

This means that the holder for the at least one laser scanner can beformed by a gantry movable in the Y direction, as in the gantry system.Instead, the receiving means for the coated substrate can be formed by atable movable in the Y direction, as in the split-axis system, while theholder comprises a stationary gantry on which the laser scanner orscanners are disposed so as to be movable in the X direction.

It is not necessary for each laser scanner to possess a separate lasersource. Rather, the laser beam of the laser source can be split intopartial beams, with each partial beam being reflected by the at leastone mirror of the laser scanner in order for said laser scanner to scanthe field associated therewith. This means that if the laser source ispowerful, the laser beam can be split in order for a partial beam tothen produce the separating line sections of the particular field.

It is preferable to use a neodymium-doped solid-state laser, inparticular a neodymium-doped yttrium vanadate laser (Nd:YVO4 laser) orneodymium-doped yttrium aluminum garnet laser (Nd:YAG laser) with afundamental wavelength of 1064 nm or the second harmonic wavelength of532 nm or the third harmonic wavelength of 335 nm.

The loading and unloading of the substrate can be effected from the sameside of the inventive function layer patterning apparatus. However, itis preferable to provide a device for transporting the coated substratereceived by the receiving means from a loading station on one side ofthe inventive function layer patterning apparatus or processing stationto an unloading station on the other side of the apparatus.

The transport device can be an endless conveying device which isprovided with a receiving means with a fixing device, for example aclamping device, for the coated substrate, but it can also be formed byanother device which moves the receiving means on which the coatedsubstrate is fixed e.g. with a clamping device from the loading stationover the patterning apparatus to the unloading station.

The coated substrate can be loaded into the loading station for examplewith a multi-axis robot such that after fixation of the substrate thelaser beam is focused directly into the functional layer during thepatterning process, or if the substrate is loaded and fixed at a 180°tilt, the laser beam is focused into the thin functional layer throughthe transparent substrate. The patterning process is preferably carriedout with the substrate standing on end, through which the laser beam isfocused into the functional layer.

After fixation in the loading station, the substrate is transported bythe transport device into the patterning apparatus or processingstation, and fixed.

For position detection and adjustment of the coated substrate in theloading station there can be provided for example two cameras whichdetermine the position of the substrate with image-processing software.A mechanism integrated in the patterning apparatus can then parallelizethe substrate with the coordinate system of the software by rotating thesubstrate. The offset in the X and Y directions is calculated into thesoftware, for example, and the coordinate system of the software shiftedaccordingly in X and Y. The parallelization of the substrate can also beeffected, as an alternative to mechanical rotation of the substrate, byrotation of the coordinate system of the software. The substrate is thusadjusted in the patterning apparatus or processing station.

Hereinafter the invention will be explained more closely by way ofexample with reference to the enclosed drawing. Therein is shownschematically:

FIG. 1 a section through a part of a photovoltaic module substrateprovided with series-connected cells, the functional layers being showngreatly enlarged;

FIG. 2 a perspective view of a laser scanner and of a part of the coatedsubstrate;

FIGS. 3 and 4 the front view of a machine according to the gantry systemor split-axis system for producing the separating lines in a functionallayer of the substrate;

FIG. 5 the front view of a gantry with offset laser scanners;

FIG. 6 a cross section along the line V-V in FIG. 3;

FIG. 7 a plan view of two fields adjacent in the Y direction; and

FIG. 8 an enlarged representation of the area A in FIG. 7.

According to FIG. 1, a transparent substrate 1, for example a glassplate, has a transparent front electrode layer 2, a semiconductor layer3 and a back electrode layer 4.

The functional layers 2, 3 and 4 are provided with separating lines 5,6, 7 to form series-connected strip-shaped cells C1, C2, . . . .

The separating lines 5, 6, 7 are produced with laser scanners 8.

According to FIG. 2, the laser scanner 8 has two mirrors 12, 13rotatable around the orthogonal axes 9, 10 for reflecting the laser beam14 from the laser source 15 to a focusing optic 16 for focusing thelaser beam 14 on the functional layer, for example the front electrodelayer 2.

As shown in FIG. 2, the laser beam 14 of each laser scanner 8 scans afocusing surface or field 17, e.g. with a length L of 150 mm and a widthB of 150 mm, on the functional layer 2 which is to be provided with theseparating lines 5 extending in the Y direction (FIG. 7).

For this purpose, the laser scanner 8 is provided with the two mirrors12, 13 each operable by a galvanometer drive (not shown).

Laser scanners with a scanning head as shown by “8” in FIG. 2 are known.It is also common to use a galvanometer drive (“galvo” for short) forrotating the mirrors.

To produce a line, i.e. a section 18 (FIG. 2) of a separating line 5 inthe field 17, the mirror 12 is rotated and thereby the laser beam 14deflected in the Y direction.

After producing in the field 17 the separating line section 18 extendingover the total length L of the field 17 in FIG. 2, the laser beam 14must be guided onto the next line 19 shown by a dashed line in FIG. 2 inorder to produce the next parallel separating line section in the field17.

For this purpose, the mirror 13 is first rotated and thus the laser beam14 guided in the X direction perpendicular to the Y direction by thedistance b which corresponds to the spacing of two adjacent separatinglines 5 in the functional layer 2. The mirror 12 is then operated again,thereby forming in the line 19 the next separating line sectionextending over the total length of the field 18. This process isrepeated until the field 17 is provided with separating line sections 18across its total width B.

According to FIGS. 3 and 4, a machine for forming the separating lines5, 6, 7 has a loading station 21 on which the substrate 1 coated forexample with the front electrode layer 2 is fixed on end, optionallyalso obliquely, with a receiving means 22 formed by a clamping device.

From the loading station 21 the substrate 1 is moved in the Y directionto the processing station 23 where the separating lines 5 are producedin the layer 2, and from there to the unloading station 24 on the otherside of the processing station 23.

The processing station 23 has eight laser scanners 8 each with one lasersource 15. The eight laser scanners 8 are disposed on a holder 26configured as a gantry and thus extend in a row transversely, i.e. inthe X direction, across the substrate 1 to be processed whose layer 2 isto be provided with the separating lines 5.

Each laser scanner 8 according to FIGS. 3 and 4 is constructedsubstantially as described in connection with FIG. 2. This means thatall eight laser scanners 8 simultaneously provide the field 17 locatedtherebelow with separating line sections 18 extending over the totallength L of each field 17. The individual fields 17 under the laserscanners 8 adjoin each other in the Y direction. Thus, the substrate 1is provided across its total width with parallel separating linesections 18 disposed in a row which have a length L corresponding to thefields 17.

In the next step, the laser scanners 8 must be moved relative to thesubstrate 1 in the Y direction, by a distance corresponding at the mostto the length L of the fields 17.

Then the laser scanners 8 form a second row of parallel separating linesections 18 extending across the total width of the substrate 1. Thisprocess is repeated until the separating line sections 18 of theindividual rows form continuous separating lines 5 extending in the Ydirection over the total length of the substrate 1 in the layer 2.

It should be noted that the distance by which the laser scanners 8 aremoved in the Y direction upon each step is somewhat smaller than thelength of the fields 17 in order to obtain an overlap of the fields 17in the Y direction. In order for continuous separating lines to beformed, it is further required that the individual separating linesections 18 of each separating line 5 are mutually flush.

This is shown more closely in FIGS. 7 and 8. FIG. 7 shows two fields 17,17′ adjoining each other in the Y direction, with the separating lines 5which are formed by the separating line sections 18, 18′ of adjacentfields 17, 17′.

If the width B′ of the separating lines is e.g. 50 μm, a precision of±25 μm in the X direction must be maintained, and continuous separatinglines 18, 18′ are formed by an overlap 30.

While the holder 26 configured as a gantry is moved in the Y directionin the gantry system shown in FIG. 3 for relative motion of the laserscanners 8 and of the substrate 1, the substrate 1 is moved in the Ydirection in the split-axis system shown in FIG. 4 with the holder 26stationary.

As shown in FIG. 5, the laser scanners 8 can also be disposed on theholder 26 so as to he offset in the Y direction, such that a laserscanner 8 offset in one Y direction, e.g. to the left, is aligned instaggered relationship with two laser scanners 8 offset in the other Ydirection, i.e. to the right.

As indicated by FIG. 6, the layer to be processed, for example the frontelectrode layer 2, must be disposed exactly in the focusing plane of thelaser scanners 8. For this purpose, two cameras 28 are disposed on theprocessing station 23 so that a position detection and thus adjustmentof the substrate 1 in the processing station 23 is possible by imageprocessing.

In the above-described exemplary embodiment, the X-axis of the gantrysystem according to FIG. 3 has eight adjacent laser scanners 8, withadjacent focusing fields 17 preferably overlapping by a few millimeters.For a substrate 1 with e.g. 1300 mm length in the Y direction, ninesteps are required for patterning the substrate 1 with a size of forexample 1.4 m² at an area of the focusing field of 150×150 mm² per laserscanner 8.

In doing so, for example twenty separating line sections 18 can beproduced side by side in a field 17, so that 160 separating linesections 18 can be lasered with the eight laser scanners 8 in one step.A high motion speed of the laser focal point 29 (FIG. 2) can be obtainedby the mirrors 12, 13 of 1200 mm/s for example. The acceleration time isvery short and can therefore be neglected. The feed of the holder 26 orof the substrate 1 in the Y direction can be for example 0.5 seconds perstep, so that for a 1.4 m² module the processing time for all separatinglines of one layer is only 27 seconds, as opposed to e.g. approx. 90seconds according to the prior art.

Moreover, the motion speed of the focal point 29 can be considerablyincreased without any additional constructional effort. The limit of themotion speed of the focal point is determined only by the quality of thelaser process. This means that the motion speed can also be, instead of1200 mm/s, for example 4000m/s and more, thereby permitting theprocessing time to be reduced to 9 seconds or less.

When the machine is designed as a continuous flow system according toFIGS. 3 and 4, the loading of the substrate 1 can furthermore beeffected on one side of the processing station 23 and the unloading ofthe substrate 1 on the other side thereof, whereby the fixing of thesubstrate 1 can be carried out in the upstream loading station 21 andthe release of the substrate 1 in the unloading station 24, so that theadditional time to be taken into account is only the time fortransporting the substrate 1 from the loading station 21 to theprocessing station 23 and the time for position detection and adjustmentof the substrate 1 in the processing station 23. However, these twotimes are only approx. 5 seconds for transport and approx. 8 seconds forposition detection and adjustment, i.e. only about 13 seconds.

Through exact calibration in the Y and X directions in the focal planeof the laser scanners 8 and the drift and offset compensation of thegalvanometer scanner technology, the overlap of the separating linesections 18 lasered per field 17 can be effected in the single-digit μmrange.

Thus, the processing time for forming the separating lines 5, 6, 7 canbe reduced by more than 70% at low additional cost for equipment.

Patterning has been explained hereinabove in the Y direction, i.e. inthe longitudinal direction of the rectangular substrate I. However,separating lines and thus separating line sections can also extend inthe X direction, e.g. across the total width of the coated substrate.For this purpose, the laser scanners 8 form in one step continuousseparating lines extending across the total width, i.e. length of thesubstrate 1 in the X direction. Then there is effected a relative motionof the laser scanners 8 and of the substrate 1 in the Y direction by atthe most a distance corresponding to the length L of the fields 17,whereupon the laser scanners 8 again form continuous separating linesextending across the total width of the functional layer of thesubstrate 1, etc.

1. A method for forming separating lines during manufacture of aphotovoltaic module with series-connected cells, whereby the separatinglines are produced in the transparent front electrode layer, thesemiconductor layer and/or the back electrode layer, which are depositedon a substrate as functional layers, with laser scanners, each with arotatable mirror and laser beam during manufacture of a photovoltaicmodule with series-connected cells, the laser scanners producingadjacent separating line sections in adjacent fields in the functionallayer or layers by deflection of the laser beam with the rotatablemirror, and the laser scanners and the coated substrate are movedrelative to each other along the separating lines to be formed in orderto produce further adjacent separating line sections in the functionallayer or layers, so that continuous separating lines are formed from theseparating line sections, characterized in that the laser beam, afterproducing a separating line section in the particular field, is soaligned with the mirror that it produces the next parallel separatingline in the field, and a plurality of the laser scanners adjacent in thetransverse direction (X) to the separating lines are used, whereby thewidth (B) of the field scanned by each laser scanner is dimensioned inthe transverse direction (X) to the separating lines such that it is atthe most one separating line spacing away from the field scanned by theadjacent laser scanner.
 2. The method according to claim 1,characterized in that the laser scanner, after scanning the particularfield, is moved relative to the coated substrate in the direction (Y) ofthe separating lines by a distance corresponding at the most to thelength (L) of the scanned field in the direction of the separatinglines.
 3. The method according to claim 1 characterized in that the atleast one laser scanner is moved relative to the coated substrate in thetransverse direction (X) transverse to the direction (Y) of theseparating lines by a distance corresponding at the most to the width(B) of the scanned field until the coated substrate is provided with theadjacent separating line sections across its total width.
 4. The methodaccording to claim 2, characterized in that the length (L) or width (B)of the field scanned by each laser scanner in the direction (Y) of theseparating lines or transverse direction (X) is at least 100 mm.
 5. Themethod according to claim 1, characterized in that the laser beam scansthe coated substrate at a speed of at least 1 m/s.
 6. An apparatus forcarrying out the method according to claim 1, characterized in that thelaser scanners each have at least one rotatable mirror for deflectingthe laser beam, and there are provided a holder for the laser scannersdisposed in the transverse direction (X) to the separating lines, areceiving means for the coated substrate, and a device for moving theholder and the receiving means relative to each other in the direction(Y) of the separating lines to be formed, further a drive for activatingthe at least one mirror of the laser scanners such that the laser beamproduces in the field scanned thereby a plurality of adjacent separatingline sections in the functional layer or layers, whereby the device forrelative motion of the holder and the receiving means is drivable suchthat the laser scanners and the coated substrate are moved relative toeach other by a distance corresponding at the most to the length (L) ofthe field in the direction (Y) of the separating lines in order to formcontinuous separating lines with the mutually flush separating linesections, and the fields scanned by two adjacent laser scanners are atthe most one separating line spacing away from each other in thetransverse direction (X).
 7. The apparatus according to claim 6,characterized in that the adjacent laser scanners are disposed on theholder so as to be offset in the direction (Y) of the separating linessuch that a laser scanner offset in one direction is aligned instaggered relationship with two laser scanners offset in the oppositedirection.
 8. The apparatus according to claim 6, characterized in thatthe holder is formed by a gantry movable in the direction (Y) of theseparating lines.
 9. The apparatus according to claim 6, characterizedin that the receiving means for the coated substrate is configured to bemovable in the direction (Y) of the separating lines and optionally inthe transverse direction (X).
 10. The apparatus according to claim 6,characterized in that a device is provided for splitting the laser beamof the laser source into partial beams, there being disposed in eachpartial beam at least one mirror of the laser scanner.
 11. The apparatusaccording to claim 6, characterized in that the drive of the at leastone mirror is formed by a galvanometer drive.
 12. The apparatusaccording to claim 6, characterized in that the laser scanner has tworotatable mirrors disposed at an angle to each other via which the laserbeam is reflected onto the coated substrate.
 13. The apparatus accordingto claim 6, characterized by a device for transporting the coatedsubstrate received by the receiving means from a loading station on oneside of the laser patterning apparatus, which constitutes the processingstation of the machine, to an unloading station on the other side of theprocessing station.
 14. The apparatus according to claim 13,characterized in that a multi-axis robot is provided for loading theloading station with the coated substrate.
 15. The apparatus accordingto claim 6, characterized in that the receiving means has a fixingdevice for the coated substrate.
 16. The apparatus according to claim 6,characterized by a device for position detection and adjustment of thesubstrate received by the receiving means.
 17. The apparatus accordingto claim 6, characterized in that the laser of the laser scanner isformed by a neodymium-doped yttrium aluminum garnet laser or yttriumvanadate solid-state laser.